Rigid-flex Circuits|Rigid Flexible PCB-Best FPC

Here are stacks up of normal 6L rigid-flex circuits (2L FR4 PCB +2L FPC +2L PCB) and you can see, normally the inner layers are flexible circuits which are easier to be made and have lower price.
Here are stacks up of normal 6L rigid-flex circuits (2L FR4 PCB +2L FPC +2L PCB)

Rigid flex circuits have been used in the military and aerospace industries for more than 20 years. In most rigid-flex circuit boards, the circuitry consists of multiple flexible circuit inner layers. However, a multilayer rigid-flex circuit incorporates a flexible circuit layer externally, internally or both as needed to accomplish the design. Best Technology can also manufacture rigid-flex circuit with outer layers to be flexible circuits.

Rigid-flex PCB is different from a multi-layer flex circuit

Click to download more stacks up of rigid-flex circuit boards from Best Technology.

Rigid-flex PCB is different from a multi-layer flex circuit. with stiffeners by having conductors on the rigid layers. Plated through holes (PTH) extend through both rigid and flexible layers, so that DIP components can be soldered on the circuit more firmly, and it has more flatness and stability.

vantage of Rigid Flex Circuit

High Density Applications: The rigid area of a rigid flex circuit is utilized for high density device population. In addition, finer line width & space is allowed in flexible circuits, so more density can be used. Denser device populations and lighter conductors can be designed into a product, freeing space for additional product features.

More application: Advances in rigid circuit board technology has broadened the applications on electronic products from communication, computer, and consumer electronics, to medical, automotive, and military electronics.

Increasing demand for more powerful and smaller products drives the need for multiple layers to accommodate denser, finer line width and spacing and smaller hole sizes.

Highly complex configurations

Less electronics components need

Reduced interconnections

Package Size and Weight Reduction

Additionally, air gap which widely used in a multi-layer flex circuit can be also used, and other feature such as controlled impedance(插入impedance-control.htm), EMI shielding, panelization, stiffeners , PSA, Circuit Assembly (SMT) are also available.

Rigid Flexible Circuit Capability

As a professional manufacturer of rigid flexible circuit board in China, Best Technology always try to improve our capability to produce more rigid-flex circuit board to our customers. Here is major capability:

1-10 flexible layers; multiple flex layers in either bonded or air gap configuration

1-40 rigid layers

2-50 layer rigid flexible circuits

Flex Core Materials: Polyimide (PI): 1/2 mil to 4 mils in either adhesive or adhesives constructions

Copper thickness: 1/3 OZ – 2 OZ RA or ED type (insert material/copper-foil.htm) in flexible circuit; 1/2OZ to 10 OZ in rigid circuits;

Coverlays: 1/2 mil to 2 mils polyimide

Stiffeners material: polyimide, FR4, stainless steel, aluminum

Rigid Materials: 130, 170, 180 TG FR4, low flow prepreg

EMI/RF shielding films

Blind and buried vias available

Any layer available

Controlled impedance: 50 ohm, 90 Ohm, 100 Ohm, 110 Ohm and other value

Surface finishing: ENIG, ENEPIG, gold plating, gold fingers (3-30u” Au), Immersion silver

IPC 6013 – Class II & Class III available

Rigid-flex Circuits

vantage of Rigid Flex Circuit

Rigid Flexible Circuit Capability

Rigid Flex Circuit Manufacturing Process: